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Authors: Jon Vedum, Morten H. Røed, Sigbjørn Kolberg, Magnus Hjelstuen, Anders E. Liverud, Øyvind N. Stamnes
Journal title: Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT)
Journal number: 2017/HiTen
Journal publisher: IMAPS International Conference on High Temperature Electronics Network (HiTEN 2017)
Published year: 2017
Published pages: 000011-000019
DOI identifier: 10.4071/2380-4491.2017.hiten.11
ISSN: 2380-4491