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Authors: Jianqi Liu, Jiafu Wan, Dongyao Jia, Bi Zeng, Di Li, Ching-Hsien Hsu, Haibo Chen
Journal title: IEEE Communications Magazine
Journal number: 55/1
Journal publisher: Institute of Electrical and Electronics Engineers
Published year: 2017
Published pages: 34-40
DOI identifier: 10.1109/MCOM.2017.1600371CM
ISSN: 0163-6804