Through Silicon Vias in MEMS packaging, a review

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Authors: Guido Sordo, Cristian Collini, Sigurd Moe and Daniel Nilsen Wright

Journal title: 2019 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)

Journal publisher: IMAPS Nordic

Published year: 2019

ISBN: 978-91-519-2089-4