Aero Acoustic MEMS Microphone Integration in Ultra-Thin and Flexible Substrate

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Authors: Kolja Erbacher; Joao Alves Marques; Malte von Krshiwoblozki; Lixiang Wu; Ha Duong Ngo; Martin Schneider-Ramelow

Journal title: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)

Journal publisher: IEEE

Published year: 2022

DOI identifier: 10.1109/eptc56328.2022.10013281