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Authors: José A. García-Souto, Javier Lázaro-Fernández, Pablo Acedo
Journal title: 2022 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)
Journal publisher: IEEE
Published year: 2022
DOI identifier: 10.1109/dtip56576.2022.9911756
ISBN: 978-1-6654-9167-9