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Authors: José A. García-Souto, Cindy Báez, Kolja J. Erbacher, Pablo Carrillo-Agudo, Ha Duong Ngo, Pablo Acedo
Journal title: 2023 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)
Journal publisher: IEEE
Published year: 2023
DOI identifier: 10.1109/dtip58682.2023.10267950