Pixel chipsets

Summary
A Timepix3 chip will be bonded to a standard 300 µm thick silicon pixel detector of the same cell size (55µm×55µm) to produce a sensor-Timepix3 chipset.
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Web resources: https://ec.europa.eu/research/participants/documents/downloadPublic?documentIds=080166e5d90fc999&appId=PPGMS
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