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Authors: H. Yu; H. D. Tuan; E. Dutkiewicz; H. V. Poor; L. Hanzo
Journal title: IEEE Transactions on Wireless Communications
Journal number: 22/5
Journal publisher: Institute of Electrical and Electronics Engineers
Published year: 2023
DOI identifier: 10.1109/twc.2022.3217145
ISSN: 1536-1276