Solid-Liquid Interdiffusion (SLID) Bonding of p-Type Skutterudite Thermoelectric Material Using Al-Ni Interlayers

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Authors: Katarzyna Placha, Richard S. Tuley, Milena Salvo, Valentina Casalegno, Kevin Simpson

Journal title: Materials

Journal number: 11/12

Journal publisher: MDPI Open Access Publishing

Published year: 2018

Published pages: 2483

DOI identifier: 10.3390/ma11122483

ISSN: 1996-1944