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Authors: A. Ragusa, H. Sasse, A. Duffy, F. Rachidi, M. Rubinstein
Journal title: IEEE Letters on Electromagnetic Compatibility Practice and Applications
Journal number: 3/1
Journal publisher: IEEE
Published year: 2021
Published pages: 24-28
DOI identifier: 10.1109/lemcpa.2020.3032465
ISSN: 2637-6423