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Authors: A. Cremasco, M. Curti, J. van Duivenbode, D. Rothmund, E. A. Lomonova
Journal title: CEIDP 2022 (Conference on Electrical Insulation and Dielectric Phenomena)
Journal publisher: IEEE
Published year: 2022
DOI identifier: 10.1109/ceidp50766.2021.9705406
ISBN: 978-1-6654-1907-9