Fabrication of polymer electronic boards by ultrasonic embossing and welding

Summary

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Authors: Liangyu Cui, Christof Gerhardy, Werner K. Schomburg, Yanling Tian, Dawei Zhang

Journal title: Microsystem Technologies

Journal number: 21/2

Journal publisher: Springer Verlag

Published year: 2015

Published pages: 365-369

DOI identifier: 10.1007/s00542-013-2018-2

ISSN: 0946-7076