In-Chip Microfluidic Cooling Integrated on GaN Power IC Reaching High Power Density of 78kW/l

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Authors: Remco van Erp, Nirmana Perera, Luca Nela, Ibrahim Osama Elhagali, Hongkeng Zhu, and Elison Matioli

Journal title: IEEE Transactions on Power Electronics

Journal publisher: IEEE

Published year: 2024

DOI identifier: 10.1109/TPEL.2024.3396508

ISSN: 0885-8993