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Authors: Qiulin Yu, Vikram G. Kamble, Dieter P. Gruber, Peter F. Fuchs, Karl Fendt, Thomas Krivec
Journal title: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Journal number: 209
Journal publisher: IEEE
Published year: 2024
DOI identifier: 10.1109/EuroSimE60745.2024.10491544
ISSN: 2833-8596