Warpage Optimization of Package Substrates Using Metamodels - A Review

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Authors: Fredy John Porathur, Vikram G Kamble, Eduard Stadler, Fabian Huber, Dieter P. Gruber, Peter Filipp Fuchs

Journal title: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

Journal publisher: IEEE

Published year: 2024

DOI identifier: 10.1109/EuroSimE60745.2024.10491528

ISSN: 2833-8596