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Authors: A.D. Boccardo, M. Tong, S.B. Leen, D. Tourret, J. Segurado
Journal title: Computational Materials Science
Journal number: 228
Journal publisher: Elsevier BV
Published year: 2023
DOI identifier: 10.1016/j.commatsci.2023.112313
ISSN: 0927-0256