Design of Power SiC Transistor Embedded in PCB Supported by 3D Thermo-Mechanical Simulations

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Authors: A. Chvála, P. Suhaj, M. Florovič, J. Marek

Journal title: 2024 15th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM)

Journal publisher: IEEE

Published year: 2025

DOI identifier: 10.1109/ASDAM63148.2024.10844645