Physics-of-Failure based Lifetime Prediction for Power Electronics under Mission Profile Load Conditions

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Authors: Albrecht Jain, Horn Tobias Daniel, Leonhard Hertenstein, Rzepka Sven

Journal title: 2025 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

Journal publisher: IEEE

Published year: 2025

DOI identifier: 10.1109/EUROSIME65125.2025.11006588

ISSN: 2833-8596