Chip and Package-Scale Interconnects for General-Purpose, Domain-Specific, and Quantum Computing Systems—Overview, Challenges, and Opportunities

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Authors: Abhijit Das, Maurizio Palesi, John Kim, Partha Pratim Pande

Journal title: IEEE Journal on Emerging and Selected Topics in Circuits and Systems

Journal number: 14

Journal publisher: Institute of Electrical and Electronics Engineers (IEEE)

Published year: 2024

DOI identifier: 10.1109/JETCAS.2024.3445829

ISSN: 2156-3357