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Authors: S. Lei, R. Enright, A. Shen
Journal title: 2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
Journal publisher: IEEE
Published year: 2016
Published pages: 238-242
DOI identifier: 10.1109/THERMINIC.2016.7749058
ISBN: 978-1-5090-5451-0
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