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Authors: B. H. Nguyen; P. Czarnecki; M. Zunic; G. B. Torri; V. Rochus
Journal title: 2023 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP)
Journal publisher: IEEE
Published year: 2023
DOI identifier: 10.1109/DTIP58682.2023.10267943
ISSN: 2768-1874
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