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Authors: B.H. Nguyen; M. Zunic; G.B. Torri; V. Rochus
Journal title: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Journal publisher: IEEE
Published year: 2023
DOI identifier: 10.1109/EUROSIME56861.2023.10100791
ISSN: 2833-8596