Extraction of Thermal Packaging Stress via Intrinsic Silicon on Glass Stress Measurement

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Authors: Ahmet Arif Aslan, Erdinc Tatar

Journal title: 2025 23rd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers)

Journal publisher: IEEE

Published year: 2025

DOI identifier: 10.1109/TRANSDUCERS61432.2025.11111343