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Authors: F. J. Klupfel, P. Pichler
Journal title: 2017 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)
Journal publisher: IEEE
Published year: 2017
Published pages: 77-80
DOI identifier: 10.23919/SISPAD.2017.8085268
ISBN: 978-4-86348-610-2